TECHNOLOGY:  

Room temperature hermetic bonding and encapsulation

AFFILIATION:   Invenios, Santa Barbara, California, United States

TECHNOLOGY SUMMARY

Track: Advanced Materials
Area: Advanced Manufacturing
Tech Readiness: TRL 8

Tech Brief: The ability to hermetically bond hard substrates at true-room temperature conditions and to develop electrical interconnects directly through the bond joint without requiring TGV's or TSV's.

FIGURES OF MERIT

Value Proposition: There is no other technology currently available that allows for the ambient temperature hermetic encapsulation of electronics, vacuum, pressure or fluids. Unique applications of this technology can be found in the manufacture of armored windows, photonic arrays, electronic packaging, airplane sensor packaging and liquid lens manufacture (Extremely fast auto-focus, optically image stabilized lenses with no moving parts)

SHOWCASE SUMMARY

Org Type: Small to Medium Enterprise
Website: http://invenios.com/
Booth Number: 1011