Direct transfer printing tools for flexible hybrid electronics and photonics assembly☆
|AFFILIATION:||systeMECH, LLC, Madison, Wisconsin, United States|
Track: Advanced Materials
Area: Advanced Manufacturing
Tech Readiness: TRL 4
Tech Brief: systeMECH is developing manufacturing tools and processes for placing thin, high-performance semiconductor components directly onto flexible substrates in order to build flexible hybrid electronic and photonic devices.
Value Proposition: There is an increasing need for flexible electronic and photonic devices and robust nanomanufacturing approaches in both the commercial market and in military applications. The key applications that are driving flexible hybrid sensor manufacturing include wearable health monitoring, medical health monitoring, structural health monitoring, sensing for automobiles and aircraft, and robotics. Flexible optical devices including waveguides, detectors, sensors, photodiodes, photovoltaics, and lasers will lead to dramatic improvements in communication, sensing, and information processing in defense-related applications.
Org Type: Early-stage Startup (Seed)
Booth Number: T320